Z-Packaging Technology For Focal-Plane Assembly

D. J. Carlson; A. D. Markum; R. S. Spriggs; J. Y. Wong

doi:10.1117/12.959311

18 February 1981 Z-Packaging Technology For Focal-Plane Assembly

D. J. Carlson, A. D. Markum, R. S. Spriggs, J. Y. Wong

Proceedings Volume 0244, Mosaic Focal Plane Methodologies I; (1981) https://doi.org/10.1117/12.959311
Event: 24th Annual Technical Symposium, 1980, San Diego, United States

Abstract

Staring mosaic focal planes, which are under development, combined detectors and associated signal processing to perform their mission functions. Much of the development work is centered on planar approaches in which a two dimensional detector array is sandwiched together with a two-dimensional signal processing array. This paper defines the "Z-tech-nology", a three-dimensional architecture as contrasted to the planar architectures. The status of the Z-technology as fabricated and tested at this time is reviewed, and near-term and long range design developments and goals are described. It is concluded that the Z-technology approach represents a low risk alternative to planar approaches, and has an inherent degree of flexibility which should prove to be cost effective.

Citation Download Citation

D. J. Carlson, A. D. Markum, R. S. Spriggs, and J. Y. Wong "Z-Packaging Technology For Focal-Plane Assembly", Proc. SPIE 0244, Mosaic Focal Plane Methodologies I, (18 February 1981); https://doi.org/10.1117/12.959311

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