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By means of a plan processing of N-BK7 and SF56 samples by a plan-polishing process, the influence on the process results, material removal rate (MRR), micro roughness and cleanliness caused by slurry and polishing pad is shown. It turns out that the type of polish pad has the biggest impact on the results. The easy-to-process material N-BK7 shows only little influence by the type of slurry used. The more challenging SF56, however, shows significant effects, especially in the area of the resulting micro roughness and the appearance of surface damages like orange peel. Especially the use of Auerpol® PZ500 shows clear advantages here. For a selection of three out of nine polishing pads, the effect of density variation of the slurry was also investigated. Lower particle concentrations lead to lower material removal rates. This applies to both materials. The more sensitive SF56 shows a reduction in micro roughness by the use of a less dense slurry. The correct selection of the polishing pad has a positive effect on the material removal rate and/or the micro roughness in all tested materials. An adaptation of the type and concentration of the slurry is especially important for more sensitive materials and in combination with the right polishing pad. In view of the development towards special materials and small lot sizes, the targeted and correct selection of polishing slurries and pads becomes more and more important. The information required for this purpose on the behavior of the pads and slurries available on the market must therefore first be determined in a targeted manner and clearly presented. |
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