Laser system for measuring MEMS relief created by the method of deep reactive ion etching

Tadeáš Maňka; Mojmír Šerý; Stanislav Krátký; Pavel Zemánek

doi:10.1117/12.2518098

18 December 2018 Laser system for measuring MEMS relief created by the method of deep reactive ion etching

Tadeáš Maňka, Mojmír Šerý, Stanislav Krátký, Pavel Zemánek

Proceedings Volume 10976, 21st Czech-Polish-Slovak Optical Conference on Wave and Quantum Aspects of Contemporary Optics; 109760M (2018) https://doi.org/10.1117/12.2518098
Event: 21st Czech-Polish-Slovak Optical Conference on Wave and Quantum Aspects of Contemporary Optics, 2018, Lednice, Czech Republic

Abstract

The method of laser interferometry is presented appropriate for precise determination of the depth of etching in a deep reactive ion etching system (DRIE), primarily used for the manufacturing of micro-electro-mechanical systems (MEMS). The system uses previous interferometer designs developed at the Institute of Institute of Scientific Instruments of the CAS, v. v. i. (ISI). We designed and manufactured a measurement system for specific MEMS and its functionality verified with the KLATencor D-120 profilometer.

Citation Download Citation

Tadeáš Maňka, Mojmír Šerý, Stanislav Krátký, and Pavel Zemánek "Laser system for measuring MEMS relief created by the method of deep reactive ion etching", Proc. SPIE 10976, 21st Czech-Polish-Slovak Optical Conference on Wave and Quantum Aspects of Contemporary Optics, 109760M (18 December 2018); https://doi.org/10.1117/12.2518098

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