Analysis of underfill technology for large-scale IRFPA devices

Zhe Kang; Tao Wen; Shuling Wei

doi:10.1117/12.2579803

5 November 2020 Analysis of underfill technology for large-scale IRFPA devices

Zhe Kang, Tao Wen, Shuling Wei

Proceedings Volume 11563, AOPC 2020: Infrared Device and Infrared Technology; 115630H (2020) https://doi.org/10.1117/12.2579803
Event: Applied Optics and Photonics China (AOPC 2020), 2020, Beijing, China

Abstract

The underfill technology of a large-scale infrared focal plane detector chip is studied. The flow characteristics and principle of filling glue were analyzed. By changing the chip angle, the gap between the detector chip and the readout circuit is filled by fluid capillary action of spontaneous siphon phenomenon, and the incomplete filling caused by the rapid flow of glue around the edge of the chip was avoided at the same time. The formula of filling time of vertical dispensing is given, and the relationship between the process form, design appearance of large-scale infrared focal plane detector chip and dispensing process was analyzed.

Citation Download Citation

Zhe Kang, Tao Wen, and Shuling Wei "Analysis of underfill technology for large-scale IRFPA devices", Proc. SPIE 11563, AOPC 2020: Infrared Device and Infrared Technology, 115630H (5 November 2020); https://doi.org/10.1117/12.2579803

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