Scissionable polymer photoresist for EUV lithography

Jingyuan Deng; Sean Bailey; Christopher K. Ober

doi:10.1117/12.2605841

25 May 2022 Scissionable polymer photoresist for EUV lithography

Jingyuan Deng, Sean Bailey, Christopher K. Ober

Proceedings Volume 12055, Advances in Patterning Materials and Processes XXXIX; 120550H (2022) https://doi.org/10.1117/12.2605841
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States

Abstract

Scissionable polymers are polymers that will depolymerize under different stimuli including acid, base, and free radicals. These polymers have been investigated in the development of photoresists and other degradable materials. This work focuses on the poly(phthalaldehyde), PPA, a family of scissionable polymers. The PPA backbone consists of acetal linkages that are very sensitive to acids. Upon exposure to acids, the polymer chain depolymerizes to its corresponding monomers. This depolymerization behavior makes PPAs excellent candidates as photoresist materials. Several new PPA photoresists are being explored in this work.

Conference Presentation

Citation Download Citation

Jingyuan Deng, Sean Bailey, and Christopher K. Ober "Scissionable polymer photoresist for EUV lithography", Proc. SPIE 12055, Advances in Patterning Materials and Processes XXXIX, 120550H (25 May 2022); https://doi.org/10.1117/12.2605841

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