Three-dimension electric field simulation for electrostatic printing micropillars

Fengjun Chen; Xiaogang Du; Fan Liu

doi:10.1117/12.2679443

18 July 2023 Three-dimension electric field simulation for electrostatic printing micropillars

Fengjun Chen, Xiaogang Du, Fan Liu

Proceedings Volume 12722, Third International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2023); 127222W (2023) https://doi.org/10.1117/12.2679443
Event: International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2023), 2023, Hangzhou, China

Abstract

As a new additive manufacturing technology, electrostatic printing has the advantages of high resolution, high material applicability and no clogging. The electric field distribution (EFD) has a significant impact on the jet stability and the deposition quality during electrostatic printing microstructures. The distribution characteristics of electric fields were investigated using the finite element analysis software COMSOL Multiphysics in this paper. The distribution patterns of the electric field strength in the printing space were studied. The results show that the EFD in the three-dimension space within 0.5 mm from the nozzle is extremely complex, and jet instability occurs in this region. The influence of micropillar on the changing patterns of EFD was investigated and the self-alignment effect in electrostatic printing was revealed. This result provides an effective analytical tool for electrostatic printing, which is important for improving the regulation level of electrostatic spraying for realizing the controlled microstructures of electrostatic printing.

Citation Download Citation

Fengjun Chen, Xiaogang Du, and Fan Liu "Three-dimension electric field simulation for electrostatic printing micropillars", Proc. SPIE 12722, Third International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2023), 127222W (18 July 2023); https://doi.org/10.1117/12.2679443

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