Paper
25 September 2023 Research on PCB thermal layout optimization strategy based on improved particle swarm optimization algorithm
Chunxia Zhang, Xiaoxin Li, Dong Wei
Author Affiliations +
Abstract
With the rapid development of integrated circuits, the number of electronic components on PCBs has multiplied. The increase in the number of components has led to more factors affecting the stability of PCB, with temperature being one of them. Excessive temperature can lead to functional failure or burnout of electronic components. A hybrid algorithm based on particle swarm optimization and simulated annealing algorithm is proposed to optimize the thermal layout of PCB electronic components. The article analyzes the principle and algorithm improvement process of thermal layout optimization, provides specific optimization cases, and verifies the feasibility of this method through MATLAB simulation experiments.
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Chunxia Zhang, Xiaoxin Li, and Dong Wei "Research on PCB thermal layout optimization strategy based on improved particle swarm optimization algorithm", Proc. SPIE 12788, Second International Conference on Energy, Power, and Electrical Technology (ICEPET 2023), 127881B (25 September 2023); https://doi.org/10.1117/12.3004301
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KEYWORDS
Particle swarm optimization

Electronic components

Algorithms

Particles

Computer simulations

Thermal analysis

Analytical research

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