Presentation + Paper
11 March 2024 Repeatability study of silicon wafer shape measurements
Author Affiliations +
Proceedings Volume 12893, Photonic Instrumentation Engineering XI; 128930E (2024) https://doi.org/10.1117/12.2692506
Event: SPIE OPTO, 2024, San Francisco, California, United States
Abstract
Wave Front Phase Imaging (WFPI), a new wafer geometry technique, is presented, that acquires 16.3 million data points in 12 seconds on a full 300mm wafer, providing lateral resolution of 65μm while holding the wafer vertically. The flatness of the silicon wafers used to manufacture integrated circuits (IC) is controlled to tight tolerances to help ensure that the full wafer is sufficiently flat for lithographic processing. Advanced lithographic patterning processes require a detailed map of the free, non-gravitational wafer shape to avoid overlay errors caused by depth-of-focus issues. For a wafer shape system to perform in a high-volume manufacturing environment, repeatability is a critical measure that needs to be tested. We present WFPI as a new technique with high resolution and high data count acquired at very high-speed using a system where the wafer is free from the effects of gravity and with a very high repeatability as measured according to the Semi standards M49.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Miguel Jiménez, Kiril Ivanov Kurtev, Juan M. Trujillo-Sevilla, Rubén Abrante, Jose Manuel Ramos-Rodríguez, and Jan O. Gaudestad "Repeatability study of silicon wafer shape measurements", Proc. SPIE 12893, Photonic Instrumentation Engineering XI, 128930E (11 March 2024); https://doi.org/10.1117/12.2692506
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Semiconducting wafers

Cameras

Silicon

Photovoltaics

Mirrors

Data acquisition

Reflection

Back to Top