Validation of high-throughput AFM for copper pad metrology in high volume manufacturing

Kyung Souk Yi; Min Hong; Jiyeon Kim; Eunpa Kim; Kwang Soo Kim; Kyong Wook Noh; Su-Young Lee; Myungjun Lee; Yusin Yang; Hokyun Chin; Arseniy Kalinin; Irene Battisti; Erik Simons; Seokhan Kim; ShihWei Yu; Nelda Antonovaité; Niranjan Saikumar; Rudolf Wilhelm; Hamed Sadeghian

doi:10.1117/12.3010488

10 April 2024 Validation of high-throughput AFM for copper pad metrology in high volume manufacturing

Kyung Souk Yi, Min Hong, Jiyeon Kim, Eunpa Kim, Kwang Soo Kim, Kyong Wook Noh, Su-Young Lee, Myungjun Lee, Yusin Yang, Hokyun Chin, Arseniy Kalinin, Irene Battisti, Erik Simons, Seokhan Kim, ShihWei Yu, Nelda Antonovaité, Niranjan Saikumar, Rudolf Wilhelm, Hamed Sadeghian

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Proceedings Volume 12955, Metrology, Inspection, and Process Control XXXVIII; 129552U (2024) https://doi.org/10.1117/12.3010488
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

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Kyung Souk Yi, Min Hong, Jiyeon Kim, Eunpa Kim, Kwang Soo Kim, Kyong Wook Noh, Su-Young Lee, Myungjun Lee, Yusin Yang, Hokyun Chin, Arseniy Kalinin, Irene Battisti, Erik Simons, Seokhan Kim, ShihWei Yu, Nelda Antonovaité, Niranjan Saikumar, Rudolf Wilhelm, and Hamed Sadeghian "Validation of high-throughput AFM for copper pad metrology in high volume manufacturing", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 129552U (10 April 2024); https://doi.org/10.1117/12.3010488

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