Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications

Luisa Bozano; Roger Quon; Ben Briggs; Ryan Ley; Athena Pang; Peng Suo; Prayudi Lianto; Andy Yong; Arvind Sundarrajan; Jorge Fernandez; Niranjan Khasgiwale; C. C. Chuang; Jang Fung Chen; Siddarth Krishnan; Mike Chudzik; Chris Bencher

doi:10.1117/12.3010203

9 April 2024 Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications

Luisa Bozano, Roger Quon, Ben Briggs, Ryan Ley, Athena Pang, Peng Suo, Prayudi Lianto, Andy Yong, Arvind Sundarrajan, Jorge Fernandez, Niranjan Khasgiwale, C. C. Chuang, Jang Fung Chen, Siddarth Krishnan, Mike Chudzik, Chris Bencher

Author Affiliations +

Proceedings Volume 12957, Advances in Patterning Materials and Processes XLI; 129570X (2024) https://doi.org/10.1117/12.3010203
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

Advanced AI systems require more exotic packaging solutions to increase performance and manage power loads. Packaging designers not only need increased interconnect density through pitch scaling, but also seek to print this advantage over areas beyond the capability of standard lithography. These demands call for innovations in materials, processes, integrations, and tools for packaging. In a bid to find solutions for finer L/S pattern in redistribution layers, photo-imageable polyimides (PIDs) from different vendors were tested for performance properties (resolution, dose to size, sidewall quality) using direct write exposure methods, and then assessed for compatibility in a dual damascene (DD) integration for FOWLP packaging.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Luisa Bozano, Roger Quon, Ben Briggs, Ryan Ley, Athena Pang, Peng Suo, Prayudi Lianto, Andy Yong, Arvind Sundarrajan, Jorge Fernandez, Niranjan Khasgiwale, C. C. Chuang, Jang Fung Chen, Siddarth Krishnan, Mike Chudzik, and Chris Bencher "Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications", Proc. SPIE 12957, Advances in Patterning Materials and Processes XLI, 129570X (9 April 2024); https://doi.org/10.1117/12.3010203

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