Poster + Paper
22 November 2024 Development of a system for positioning semiconductor chips using video data during installation
Author Affiliations +
Conference Poster
Abstract
Today, there are many technologies for mounting semiconductor crystals and microcircuits on substrates. Some of them require preheating the substrate, which can cause its deformation. Due to the high precision of installation, it is necessary to compensate for the thermal displacement error of the substrate and other positioning errors. To do this, reference marks are made on a heated assembly table. In addition, fiducial marks are located directly on substrates and printed circuit boards.

The main problem of introducing technical vision systems is their integration into numerical control systems of installations in order to increase the speed of technological operations. Thus, the development of real-time algorithms that determine the position of semiconductor crystals relative to the substrate, their implementation in the form of programs for specialized controllers integrated directly into CNC systems, is an urgent task.

The paper presents the implementation of a system for adjusting the position of a semiconductor crystal or microcircuit by processing a video stream from high-resolution cameras, which determines the true coordinates, position relative to the reference marks of the substrate and heating table, and outputs them directly to the CNC programmable logic controller. system. The basis of the system is the 64-bit RISC-V core.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Andrey Alepko, Tagir Abdullin, Evgenii Semenishchev, Olga Tokareva, and Prohor Karlov "Development of a system for positioning semiconductor chips using video data during installation", Proc. SPIE 13239, Optoelectronic Imaging and Multimedia Technology XI, 1323923 (22 November 2024); https://doi.org/10.1117/12.3039002
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KEYWORDS
Crystals

Semiconductors

Video

Data processing

Resistors

Video processing

Semiconducting wafers

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