Measurements and characterization of multiple-coupled interconnection lines in hybrid and monolithic integrated circuits

Leonard A. Hayden; Jyh-Ming Jong; John B. Rettig; Vijai K. Tripathi

doi:10.1117/12.25524

1 April 1991 Measurements and characterization of multiple-coupled interconnection lines in hybrid and monolithic integrated circuits

Leonard A. Hayden, Jyh-Ming Jong, John B. Rettig, Vijai K. Tripathi

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Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25524
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

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Leonard A. Hayden, Jyh-Ming Jong, John B. Rettig, and Vijai K. Tripathi "Measurements and characterization of multiple-coupled interconnection lines in hybrid and monolithic integrated circuits", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25524

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