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10 June 1994 High-speed 3D optoelectronic interconnect
Freddie Shing-Hong Lin, Cong T. Nguyen, Robert M. Mino, Peterlynn R. Bumacod, Robert L. Kaminski
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Proceedings Volume 2155, Optoelectronic Signal Processing for Phased-Array Antennas IV; (1994) https://doi.org/10.1117/12.177416
Event: OE/LASE '94, 1994, Los Angeles, CA, United States
Abstract
A demonstration hardware with high-speed, multiple optical data links was built for board-to-board optical interconnect operations. There are two types of optical interconnect paths in this hardware: interboard and backplane interconnects. It was demonstrated that multiple 500/550 MHz signals can be simultaneously transmitted in both the interboard and the backplane configurations.
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Freddie Shing-Hong Lin, Cong T. Nguyen, Robert M. Mino, Peterlynn R. Bumacod, and Robert L. Kaminski "High-speed 3D optoelectronic interconnect", Proc. SPIE 2155, Optoelectronic Signal Processing for Phased-Array Antennas IV, (10 June 1994); https://doi.org/10.1117/12.177416
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KEYWORDS
Optoelectronics
Optical interconnects
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