Poly(cyclohexyl 2-cyanoacrylate-co-ethoxyethyl 2-cyanoacrylate) as a positive-tone electron beam resist for phase-shift mask fabrication

Akira Tamura; Masaji Yonezawa; Mitsuyoshi Sato; T. Okuyama

doi:10.1117/12.191934

3 November 1994 Poly(cyclohexyl 2-cyanoacrylate-co-ethoxyethyl 2-cyanoacrylate) as a positive-tone electron beam resist for phase-shift mask fabrication

Akira Tamura, Masaji Yonezawa, Mitsuyoshi Sato, T. Okuyama

Author Affiliations +

Proceedings Volume 2254, Photomask and X-Ray Mask Technology; (1994) https://doi.org/10.1117/12.191934
Event: Photomask Japan '94, 1994, Kawasaki City, Kanagawa, Japan

Abstract

Poly(cyclohexyl 2-cyanoacrylate) (PCHCA), a positive tone electron beam resist, has both high sensitivity and high dry-etching durability. Therefore, PCHCA has been successfully used for the fabrication of conventional chromium photomasks using dry-etching. However, when PCHCA was applied to the phase-shift mask fabrication, cracks were observed in resist patterns on the SiO₂ shifter layer. The cyclic-alkyl group of PCHCA enhances dry-etching durability but causes the cracks in resist patterns. On the other hand, the noncyclic group prevent cracks, but reduces dry-etching durability. However, the copolymer of cyclohexyl 2- cyanoacrylate and ethoxyethyl 2-cyanoacrylate was delineated on SiO₂ without generating cracks and reducing dry-etching durability, with high sensitivity. Using this copolymer, the phase-shift masks having SiO₂ shifters with vertical walls were fabricated by dry-etching process in short time.

Citation Download Citation

Akira Tamura, Masaji Yonezawa, Mitsuyoshi Sato, and T. Okuyama "Poly(cyclohexyl 2-cyanoacrylate-co-ethoxyethyl 2-cyanoacrylate) as a positive-tone electron beam resist for phase-shift mask fabrication", Proc. SPIE 2254, Photomask and X-Ray Mask Technology, (3 November 1994); https://doi.org/10.1117/12.191934

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