PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
Using a single maskless postprocessing step we have developed an accelerometer in a standard commercial CMOS process capable of a sensitive axis parallel or perpendicular to the die surface. Out postprocess is realized using xenon difluoride (XeF2) as a bulk etchant. The combination of this etchant and the standard CMOS process allows realization of cantilevers with piezoresistive sensors in all spacial coordinates from a widely-accessible source and at a minimal cost. Fabrication of accelerometers for all three axes and associated electronics on a single piece of silicon reduces the cost of 3D acceleration detection while increasing sensor reliability.
Brett Warneke,Eric G. Hoffman, andKristofer S. J. Pister
"Monolithic multiple axis accelerometer design in standard CMOS", Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); https://doi.org/10.1117/12.221155
ACCESS THE FULL ARTICLE
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
Brett Warneke, Eric G. Hoffman, Kristofer S. J. Pister, "Monolithic multiple axis accelerometer design in standard CMOS," Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); https://doi.org/10.1117/12.221155