Demonstration of TC1050, encapsulated TPG graphite, as an electronic packaging material

Mark J. Montesano

doi:10.1117/12.259837

21 November 1996 Demonstration of TC1050, encapsulated TPG graphite, as an electronic packaging material

Mark J. Montesano

Proceedings Volume 2855, High Heat Flux Engineering III; (1996) https://doi.org/10.1117/12.259837
Event: SPIE's 1996 International Symposium on Optical Science, Engineering, and Instrumentation, 1996, Denver, CO, United States

Abstract

A novel, patented technique of encapsulating high thermal conductivity TPG graphite within a structural material has been developed. This macrocomposite, named TC1050, is an ideal thermal core material because of its high thermal conductivity, low mass density, and ability to have an engineered coefficient of thermal expansion. The encapsulation technique permits the decoupling of the thermal and mechanical interdependence of the constituent materials, allowing each to be optimized independently. The thermal and mechanical performance of the TC1050 material system has been demonstrated in SEM-E, VME and custom format thermal core configurations. TC1050 thermal cores are currently in use in high thermal density airborne circuit cards such as power supplies and digital signal processors and provide three times the thermal conductivity of copper at a mass density less than aluminum.

Citation Download Citation

Mark J. Montesano "Demonstration of TC1050, encapsulated TPG graphite, as an electronic packaging material", Proc. SPIE 2855, High Heat Flux Engineering III, (21 November 1996); https://doi.org/10.1117/12.259837

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