Adhesion characteristics of alicyclic polymers for use in ArF excimer laser lithography

Kaichiro Nakano; Shigeyuki Iwasa; Katsumi Maeda; Etsuo Hasegawa

doi:10.1117/12.312438

29 June 1998 Adhesion characteristics of alicyclic polymers for use in ArF excimer laser lithography

Kaichiro Nakano, Shigeyuki Iwasa, Katsumi Maeda, Etsuo Hasegawa

Proceedings Volume 3333, Advances in Resist Technology and Processing XV; (1998) https://doi.org/10.1117/12.312438
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

We evaluate the adhesion characteristics and relationship between work of adhesion and structure of polar-alicyclic polymers we developed for use in ArF excimer laser lithography. We found that the adhesion of the polymers and resists in both the alkaline-developer and water circumstances depends on the work of adhesion in air. Stronger adhesion can be obtained with higher polarity of polymer films caused by the higher surface free energy due to hydrogen bonds. The polarity of polymers and functional groups is evaluated with their relative dielectric constants. With the standard developer (2.38% tetramethylammonium hydroxide aqueous solution), the chemically amplified resist based on poly(carboxy- tetracyclo[4.4.0.1^2,5.1^7,10]dodecylacrylate- co-hydroxy-tricyclo[5.2.1.0^2,6]decylacrylate) forms a 0.18-micrometers L&S pattern by the ArF excimer laser dose.

Citation Download Citation

Kaichiro Nakano, Shigeyuki Iwasa, Katsumi Maeda, and Etsuo Hasegawa "Adhesion characteristics of alicyclic polymers for use in ArF excimer laser lithography", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); https://doi.org/10.1117/12.312438

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