Microprobes for highly localized cooling/heating applications

Lei Huang; Wanjun Wang; Michael C. Murphy

doi:10.1117/12.323907

8 September 1998 Microprobes for highly localized cooling/heating applications

Lei Huang, Wanjun Wang, Michael C. Murphy

Proceedings Volume 3514, Micromachined Devices and Components IV; (1998) https://doi.org/10.1117/12.323907
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States

Abstract

This paper reports a microfabricated array of probes suitable for highly localized temperature manipulation (cooling or heating) or temperature manipulation of micro- sized subject. These microprobes were fabricated with `LIGA' (German acronym for Lithographie, Galvanoformung, Abformung) process--one of the MEMS (microelectromechanical systems) technologies. The LIGA technology is based on X-ray lithography and electroplating and suitable for making high- aspect-ratio metal or alloy structures with aspect-ratio up to 100 times. The array of microprobes with a height of 1000 m was fabricated on the top surface of a conventional electronic cooling device based on Peltier effect. Electrical current supplied to the cooling chip causes a cooling effect and thermal conduct effect of the microprobes carries the heat from the sample subject to be cooled to the cooling chip surface. A one-stage semiconductor-cooling device with a maximum temperature difference of 20 degree(s)C was used. It was found that the maximum temperature difference that could be achieved was very close to the temperature at the surface of the electronic device and the difference is small.

Citation Download Citation

Lei Huang, Wanjun Wang, and Michael C. Murphy "Microprobes for highly localized cooling/heating applications", Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); https://doi.org/10.1117/12.323907

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