High-accuracy characterization of antireflective coatings and photoresists by spectroscopic ellipsometry: a new tool for 300-mm wafer technology

Pierre Boher; Christophe Defranoux; Sophie Bourtault; Jean-Louis P. Stehle

doi:10.1117/12.350873

14 June 1999 High-accuracy characterization of antireflective coatings and photoresists by spectroscopic ellipsometry: a new tool for 300-mm wafer technology

Pierre Boher, Christophe Defranoux, Sophie Bourtault, Jean-Louis P. Stehle

Author Affiliations +

Proceedings Volume 3677, Metrology, Inspection, and Process Control for Microlithography XIII; (1999) https://doi.org/10.1117/12.350873
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

In order to characterize 300mm wafers at different stages to the IC manufacturing, a new tool based on spectroscopic ellipsometry has been recently developed at SOPRA. This new instrument called SE-300 has some important new features compared to the other ellipsometers of SOPRA or of the competition. First the optical setup allows to obtained very small measurement spots down to 35 X 45 micrometers in polychromatic light to be able to work from deep UV 190nm to near IR; second the combined monochromator/spectrometer is directly setup on the analyzer arm and allows both multichannel and scanning measurements on the same spot. Scanning measurement made with a real double monochromator including prism and grating allows very accurate measurement that can be used to extract optical indices and solve complex multilayer structures. Multichannel measurements are made through a prism/grating spectrometer with quasi-linear dispersion in wavelength. All the elements are fully compatible with the new generation of 300mm wafers. Practical results obtained on antireflective coatings and photoresist films are presented.

Citation Download Citation

Pierre Boher, Christophe Defranoux, Sophie Bourtault, and Jean-Louis P. Stehle "High-accuracy characterization of antireflective coatings and photoresists by spectroscopic ellipsometry: a new tool for 300-mm wafer technology", Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); https://doi.org/10.1117/12.350873

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