Barbara Janyszek,1 Ryszard Jachowicz,2 Dorota Pijanowska,3 Jerzy Jazwinski4
1Industrial Institute of Automation and Measurements (Poland) 2Institute of Electronics Systems (Poland) 3Institute of Biocybernetics and Biomedical Engineering (Poland) 4Institute of Electron Technology (Poland)
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The construction of both the backside contacts and the package for replaceable sensor structure bonding has been described in the paper. Some aspects of technological process for backside contact performance are discussed in the report too. The measurement results from the structure test proved small and stable contact resistance when sensor structures have been changed in the package more than 100 times. A new method of changeable package has been shown.
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Barbara Janyszek, Ryszard Jachowicz, Dorota Pijanowska, Jerzy Jazwinski, "Backside contacts for sensor structure packaging," Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); https://doi.org/10.1117/12.341280