Some aspects on the mechanical analysis of microshutters

Rainer K. Fettig; Jonathan L. Kuhn; Samuel Harvey Moseley Jr.; Alexander S. Kutyrev; Jon Orloff; Shude D. Lu

doi:10.1117/12.360473

3 September 1999 Some aspects on the mechanical analysis of microshutters

Rainer K. Fettig, Jonathan L. Kuhn, Samuel Harvey Moseley Jr., Alexander S. Kutyrev, Jon Orloff, Shude D. Lu

Proceedings Volume 3875, Materials and Device Characterization in Micromachining II; (1999) https://doi.org/10.1117/12.360473
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

An array of individually addressable micro-shutters is being designed for spectroscopic applications. Details of the design are presented in a companion paper. The mechanical design of a single shutter element has been completed. This design consists of a shutter blade suspended on a torsion beam manufactured out of single crystal silicon membranes. During operation the shutter blade will be rotated by 90 degrees out of the array plane. Thus, the stability and durability of the beams are crucial for the reliability of the devices. Structures were fabricated using focused ion beam milling in a FEI 620 dual beam machine, and subsequent testing was completed using the same platform. This allowed for short turn around times. We performed torsion and bending experiments to determine key characteristics of the membrane material. Results of measurements on prototype shutters were compared with the predictions of the numerical models. The data from these focused studies were used in conjunction with experiments and numerical models of shutter prototypes to optimize the design. In this work, we present the results of the material studies, and assess the mechanical performance of the resulting design.

Citation Download Citation

Rainer K. Fettig, Jonathan L. Kuhn, Samuel Harvey Moseley Jr., Alexander S. Kutyrev, Jon Orloff, and Shude D. Lu "Some aspects on the mechanical analysis of microshutters", Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999); https://doi.org/10.1117/12.360473

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available