Low-temperature approaches for fabrication of high-frequency microscanners

Karla Hiller; Ramon Hahn; Christian Kaufmann; Steffen Kurth; Kersten Kehr; Thomas Gessner; Wolfram Doetzel; M. Wiemer; I. Schubert

doi:10.1117/12.361290

2 September 1999 Low-temperature approaches for fabrication of high-frequency microscanners

Karla Hiller, Ramon Hahn, Christian Kaufmann, Steffen Kurth, Kersten Kehr, Thomas Gessner, Wolfram Doetzel, M. Wiemer, I. Schubert

Author Affiliations +

Proceedings Volume 3878, Miniaturized Systems with Micro-Optics and MEMS; (1999) https://doi.org/10.1117/12.361290
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

Within this paper novel applications of low temperature silicon wafer bonding technologies for the fabrication of high frequency silicon microscanners are presented. Two technological approaches are discussed, both using low temperature bonding as a key technological step. Results of the integration of a special low temperature bonding process within the bulk technology approach are shown. Micromirror arrays fabricated with this technology are presented and show promising results for optical applications.

Citation Download Citation

Karla Hiller, Ramon Hahn, Christian Kaufmann, Steffen Kurth, Kersten Kehr, Thomas Gessner, Wolfram Doetzel, M. Wiemer, and I. Schubert "Low-temperature approaches for fabrication of high-frequency microscanners", Proc. SPIE 3878, Miniaturized Systems with Micro-Optics and MEMS, (2 September 1999); https://doi.org/10.1117/12.361290

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