Optoelectronic scalable substrates based on film/Z-connection and its application to film optical link module (FOLM)

Tetsuzo Yoshimura; James Roman; Yasuhito Takahashi; Michael Lee; Bill Chou; Solomon I. Beilin; Wen-Chou V. Wang; Masaaki Inao

doi:10.1117/12.384398

27 April 2000 Optoelectronic scalable substrates based on film/Z-connection and its application to film optical link module (FOLM)

Tetsuzo Yoshimura, James Roman, Yasuhito Takahashi, Michael Lee, Bill Chou, Solomon I. Beilin, Wen-Chou V. Wang, Masaaki Inao

Author Affiliations +

Proceedings Volume 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II; (2000) https://doi.org/10.1117/12.384398
Event: Symposium on Integrated Optoelectronics, 2000, San Jose, CA, United States

Abstract

We propose a new concept of optoelectronic (OE) interconnect hardware 'OE Scalable Substrate (OE-SS)' and 'Film Optical Link Module (FOLM)', which have potentiality to remove optics excess. The structure is as follows: OE-films, in which waveguides, thin-film OE devices, LSIs, capacitor chips etc. are integrated with via/pad/electrode, are stacked by electrical joints (Z-connections). This gives rise to standardized-interface capability and scalability. Using one basic technology 'film/Z-connection', all levels of interconnection will be achieved, including massive parallel optical link, inter-board optical connect, and 3D- stack-OE-MCM. We prose a new process 'Device Integration with Self-Organizing Transfer', which is essential for low- cost OE-SS and FOLM, especially for WDM applications.

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Tetsuzo Yoshimura, James Roman, Yasuhito Takahashi, Michael Lee, Bill Chou, Solomon I. Beilin, Wen-Chou V. Wang, and Masaaki Inao "Optoelectronic scalable substrates based on film/Z-connection and its application to film optical link module (FOLM)", Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); https://doi.org/10.1117/12.384398

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