Temperature rising effect of 193-nm chemically amplified resist during postexposure bake

Young-Mi Lee; Moon-Gyu Sung; Eun-Mi Lee; Young-Soo Sohn; Heungin Bak; Hye-Keun Oh

doi:10.1117/12.388263

23 June 2000 Temperature rising effect of 193-nm chemically amplified resist during postexposure bake

Young-Mi Lee, Moon-Gyu Sung, Eun-Mi Lee, Young-Soo Sohn, Heungin Bak, Hye-Keun Oh

Proceedings Volume 3999, Advances in Resist Technology and Processing XVII; (2000) https://doi.org/10.1117/12.388263
Event: Microlithography 2000, 2000, Santa Clara, CA, United States

Abstract

The deprotection of chemically amplified resist is amplified by photogenerated acid during post exposure bake. The deprotection rate is mainly dependent on bake temperature and time. It has been assumed that the temperature of wafer surface and photoresist is to be raised instantaneously up to desired set temperature, but in real world it can not happen. We investigated the temperature change of wafer surface on a hot plate and obtained effective post exposure bake time. We applied the effective post exposure bake time to our simulation tool and the simulation results showed a better agreement with the experimental resist profile.

Citation Download Citation

Young-Mi Lee, Moon-Gyu Sung, Eun-Mi Lee, Young-Soo Sohn, Heungin Bak, and Hye-Keun Oh "Temperature rising effect of 193-nm chemically amplified resist during postexposure bake", Proc. SPIE 3999, Advances in Resist Technology and Processing XVII, (23 June 2000); https://doi.org/10.1117/12.388263

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