Paper
29 June 2001 Multiwavelength excitation process of fused-silica by combination of F2 and KrF excimer lasers
Kotaro Obata, Koji Sugioka, Toshimitsu Akane, Naoko Aoki, Koichi Toyoda, Katsumi Midorikawa
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Abstract
Collinear irradiation system of VUV-UV multiwavelength excitation process using F2 and KrF excimer lasers has been developed. This system achieves high-quality ablation of fused silica. In addition, dependence of ablation rate on various conditions such as laser fluence, delay time of each laser irradiation, and pulse number is investigated. Multiwavelength excitation effect is strongly affected by the delay time and extremely high etching rate over 30 nm/pulse is obtained during -10 ns to 10 ns of the delay time. KrF excimer laser ablation threshold decreases and its effective absorption coefficient increases with increasing simultaneously irradiated F2 laser fluence.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kotaro Obata, Koji Sugioka, Toshimitsu Akane, Naoko Aoki, Koichi Toyoda, and Katsumi Midorikawa "Multiwavelength excitation process of fused-silica by combination of F2 and KrF excimer lasers", Proc. SPIE 4274, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, (29 June 2001); https://doi.org/10.1117/12.432506
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Cited by 1 scholarly publication.
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KEYWORDS
Excimer lasers

Laser ablation

Silica

Absorption

Vacuum ultraviolet

Laser irradiation

Electrons

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