Paper
24 July 2002 Low-cost nanostructure patterning using step and flash imprint lithography
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Proceedings Volume 4608, Nanostructure Science, Metrology, and Technology; (2002) https://doi.org/10.1117/12.437804
Event: Workshop on Nanostructure Science, Metrology, and Technology, 2001, Gaithersburg, MD, United States
Abstract
This article is directed towards nanolithography, which is the unit process required to pattern nanostructures. While the critical dimension in the microelectronics industry is continually going down due to developments in photolithography, it is coming at the expense of exponential increase in lithography tool costs and rising photomask costs. Step and Flash Imprint Lithography (S-FIL) is a nano-patterning technique that not only results in significantly lower cost of the lithography tool and process consumables, but also appears to be at least as good as photolithography in other aspects of patterning costs. In this study, a comparison of SFIL with Extreme Ultraviolet (EUV) photolithography technique is provided at the 50nm node†. Advantages and disadvantages of S-FIL for various application sectors are provided. Finally, cost of ownership (CoO) computations of S-FIL versus EUV is provided. CoO computations indicate that S-FIL may be the cost-effective technology in the sub-100nm domain, particularly for emerging devices that are required in low volumes.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
S. V. Sreenivasan, C. Grant Willson, Norman E. Schumaker, and Douglas J. Resnick "Low-cost nanostructure patterning using step and flash imprint lithography", Proc. SPIE 4608, Nanostructure Science, Metrology, and Technology, (24 July 2002); https://doi.org/10.1117/12.437804
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Cited by 14 scholarly publications.
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KEYWORDS
Lithography

Extreme ultraviolet

Optical lithography

Photomasks

Inspection

Semiconducting wafers

Extreme ultraviolet lithography

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