Resolution Enhancement Of Positive Photoresist Through Optimization Of Thermal Processing

Vic Marriott; Yi -Ching Lin; Gene Fuller

doi:10.1117/12.941778

21 May 1984 Resolution Enhancement Of Positive Photoresist Through Optimization Of Thermal Processing

Vic Marriott, Yi -Ching Lin, Gene Fuller

Proceedings Volume 0469, Advances in Resist Technology I; (1984) https://doi.org/10.1117/12.941778
Event: 1984 Microlithography Conferences, 1984, Santa Clara, United States

Abstract

Various approaches to resist baking are examined with the objective of increasing the resolution capability of conventional positive resists using standard production exposure tools. Resist prebake, post exposure bake, and deferred bake (soft bake deferred until after exposure) are examined for Shipley Microposit 1400 series photo-resists developed with Microposit MF-312 and MF-314 developers. Temperatures in the range of 60 to 120°C with hot plate and forced air convection baking methods are examined for their effects on enhanced resolution. Conclusions are based on experimental data from studies of development rates, gamma contrast parameter values, exposure latitudes, and sizing control.

Citation Download Citation

Vic Marriott, Yi -Ching Lin, and Gene Fuller "Resolution Enhancement Of Positive Photoresist Through Optimization Of Thermal Processing", Proc. SPIE 0469, Advances in Resist Technology I, (21 May 1984); https://doi.org/10.1117/12.941778

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