Paper
30 July 2002 Extending KrF to 100-nm imaging with high-NA- and chromeless phase lithography technology
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Abstract
In this paper the concept of chromeless phase lithography (CPL) is introduced and experimental results on an ASML PAS 5500/800 are presented. CPL is a single exposure technique and is capable of resolution enhancement on all device layers (bright and dark field masks). Line space structures through pitch are measured with cross section and have O.35jim depth of focus (DOF) at 10% exposure latitude without forbidden pitches. CPL experimental results for a k1 of 0.38 (½ pitch) are presented for three DRAM device layers, isolation brick wall, storage capacitor, and honeycomb contact. Each of these layers have a DOF of O.35jim at 10% exposure latitude. CPL experimental results are presented for a SRAM gate and contact with lOOnm feature size (k1=O.32) and have a DOF of O.35jim at 10% exposure latitude.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert John Socha, Douglas J. Van Den Broeke, Linda Yu, Will Conley, Wei Wu, J. Fung Chen, John S. Petersen, David J. Gerold, Judith van Praagh, Richard Droste, Donis G. Flagello, and Stephen Hsu "Extending KrF to 100-nm imaging with high-NA- and chromeless phase lithography technology", Proc. SPIE 4691, Optical Microlithography XV, (30 July 2002); https://doi.org/10.1117/12.474594
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Cited by 2 scholarly publications.
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KEYWORDS
Reticles

Lithography

Nanoimprint lithography

Scanning electron microscopy

Diffraction

Quartz

Photomasks

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