Low-stress stencil masks using SOI substrates for EPL and LEEPL

Hideyuki Eguchi; Toshiaki Kurosu; Takashi Yoshii; Hiroshi Sugimura; Kojiro Itoh; Akira Tamura

doi:10.1117/12.504234

28 August 2003 Low-stress stencil masks using SOI substrates for EPL and LEEPL

Hideyuki Eguchi, Toshiaki Kurosu, Takashi Yoshii, Hiroshi Sugimura, Kojiro Itoh, Akira Tamura

Author Affiliations +

Proceedings Volume 5130, Photomask and Next-Generation Lithography Mask Technology X; (2003) https://doi.org/10.1117/12.504234
Event: Photomask and Next Generation Lithography Mask Technology X, 2003, Yokohama, Japan

Abstract

We focus on stencil mask technologies for the next generation lithography (NGL) options such as electron projection lithography (EPL) and low energy electron-beam proximity projection lithography (LEEPL). For the production of high-quality stencil masks, we selected silicon-on-insulator (SOI) substrate as desirable stencil mask material because of its availability and quality. We showed how the membrane stress varies with dopant concentration and our proposed theoretical prediction on stress dependency on dopant concentration is consistent with experimental data. From the experimental data and prediction, doping method using SOI substrates proved to be able to produce membranes with stress of less than 10 MPa. We also presented how the out-of-plane distortions (OPD) within a subfield depend on the doping profile and cantilever beams with a length of 200 um remained flat. And then we measured the image placement (IP) errors within a subfield on a 200-mm EPL mask, which was less than 20 nm. Finally we employed the doping method to LEEPL mask and presented stress data. Therefore, we confirmed the doping method using SOI substrate is proper approach to fabricate low-stress stencil masks for EPL and LEEPL.

Citation Download Citation

Hideyuki Eguchi, Toshiaki Kurosu, Takashi Yoshii, Hiroshi Sugimura, Kojiro Itoh, and Akira Tamura "Low-stress stencil masks using SOI substrates for EPL and LEEPL", Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); https://doi.org/10.1117/12.504234

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