Paper
8 September 2004 A parallel optical interconnect link with on-chip optical access
Ronny Bockstaele, Michiel De Wilde, Wim Meeus, Olivier Rits, Hannes Lambrecht, Jan Van Campenhout, Johan De Baets, Peter Van Daele, Eric van den Berg, Michaela Klemenc, Sven Eitel, Richard Annen, Jan Van Koetsem, Gilles Widawski, Jacques Goudeau, Baudouin Bareel, Patrick Le Moine, Reto Fries, Peter Straub, Francois Marion, Julien Routin, Roel Baets
Author Affiliations +
Abstract
This paper describes a complete technology family for parallel optical interconnect systems. Key features are the two-dimensional on-chip optical access and the development of a complete optical pathway. This covers both chip-to-chip links on a single boards, chip-to-chip links over an optical backpanel, and even system-to-system interconnects. Therefore it is a scalable technology. The design of all parts of the link, and the integration of parallel optical interconnect systems in the design flow of electronic systems is presented in this paper.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ronny Bockstaele, Michiel De Wilde, Wim Meeus, Olivier Rits, Hannes Lambrecht, Jan Van Campenhout, Johan De Baets, Peter Van Daele, Eric van den Berg, Michaela Klemenc, Sven Eitel, Richard Annen, Jan Van Koetsem, Gilles Widawski, Jacques Goudeau, Baudouin Bareel, Patrick Le Moine, Reto Fries, Peter Straub, Francois Marion, Julien Routin, and Roel Baets "A parallel optical interconnect link with on-chip optical access", Proc. SPIE 5453, Micro-Optics, VCSELs, and Photonic Interconnects, (8 September 2004); https://doi.org/10.1117/12.545490
Lens.org Logo
CITATIONS
Cited by 6 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Vertical cavity surface emitting lasers

Optical interconnects

Sensors

Connectors

Waveguides

Interfaces

Polymer optical fibers

Back to Top