Low-coherence interferometry for 3D measurements of microelectronics packaging and integration

Seung-Woo Kim; Young-Sik Ghim

doi:10.1117/12.573394

17 January 2005 Low-coherence interferometry for 3D measurements of microelectronics packaging and integration

Seung-Woo Kim, Young-Sik Ghim

Proceedings Volume 5644, Optoelectronic Devices and Integration; (2005) https://doi.org/10.1117/12.573394
Event: Photonics Asia, 2004, Beijing, China

Abstract

Current technological issues arising to meet rapidly grwoing demand on 3-D measurements in the field of microelectronics packaging and integration are addressed with special emphasis on white-light interferometry. We first discuss the problem of phase change upon reflection which causes significant measurement errors unless properly compensated for measuring composite targets made of dissimilar materials. Next, an extended application of white-light interferometry is described with aims of measuring not only the surface height profile but also the thickness profile of target surfaces coated with transparent thin-film layers. Finally addressed is the dispersive white-light interferometry that draws much attention for high-speed implementation of surface metrology, which is found useful for in-situ inspection of micro-engineered surfaces.

Citation Download Citation

Seung-Woo Kim and Young-Sik Ghim "Low-coherence interferometry for 3D measurements of microelectronics packaging and integration", Proc. SPIE 5644, Optoelectronic Devices and Integration, (17 January 2005); https://doi.org/10.1117/12.573394

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