Paper
7 March 2005 Integrated planar lightwave bio/chem OEIC sensors on Si CMOS circuits
Nan Marie Jokerst, Martin A. Brooke, Sang-Yeon Cho, Mikkel Thomas, Jeffrey Lillie, Daeik Kim, Stephen Ralph, Karla Dennis, Benita Comeau, Cliff Henderson
Author Affiliations +
Abstract
Optical sensing, and the integration of sensors and electronics into Sensor on a Chip and Sensor on a Package systems are an approach to the creation of miniaturized, portable, customizable, low cost sensor systems for rapid health diagnostics, medical research, environmental monitoring, and security monitoring. To integrate optical sensing systems that are autonomous, it is essential to integrate the sensor, light source, and light detection into a single substrate or chip. The integration of this optical system with signal control and processing electronics enable discrimination with individually customized sensors in sensor arrays, and high sensitivity levels. Thin film optoelectronic active device integration with planar optical passive devices is a heterogeneous integration method for fabricating planar lightwave integrated circuits at the chip level and planar lightwave integrated systems at the substrate and package level.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nan Marie Jokerst, Martin A. Brooke, Sang-Yeon Cho, Mikkel Thomas, Jeffrey Lillie, Daeik Kim, Stephen Ralph, Karla Dennis, Benita Comeau, and Cliff Henderson "Integrated planar lightwave bio/chem OEIC sensors on Si CMOS circuits", Proc. SPIE 5730, Optoelectronic Integration on Silicon II, (7 March 2005); https://doi.org/10.1117/12.592771
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Cited by 15 scholarly publications.
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KEYWORDS
Sensors

Silicon

Thin films

CMOS sensors

Waveguides

Thin film devices

System integration

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