The heat dissipation performance of LED applied a MHP

Gwo-Jiun Sheu; Farn-Shiun Hwu; Shen-Hang Tu; Wen-Tung Chen; Jenq-Yang Chang; Jyh-Chen Chen

doi:10.1117/12.616355

14 September 2005 The heat dissipation performance of LED applied a MHP

Gwo-Jiun Sheu, Farn-Shiun Hwu, Shen-Hang Tu, Wen-Tung Chen, Jenq-Yang Chang, Jyh-Chen Chen

Proceedings Volume 5941, Fifth International Conference on Solid State Lighting; 594113 (2005) https://doi.org/10.1117/12.616355
Event: Optics and Photonics 2005, 2005, San Diego, California, United States

Abstract

This study will discuss the heat dissipation effect of light emitting diode (LED) device applied a commercial miniature heat pipe (MHP). For lowering the thermal resistance of LED, the MHP can reduce the working temperature and raise the allowable input power of LED chip obviously. By comparing with a copper rod, the LED temperature was decreased about 19% at 1.59W input power and the LED power was increased about 43% under 118°C chip temperature. On the other hand, the thermal resistance of LED also can be reduced by using a thinner slug. Moreover, the results showed that the thermal spreading effect was significant. The MHP could be used to avoid the hot spot of LED packaging due to its excellent heat spreading property. Simultaneously, a LED thermal simulation was carried out to verify the optimum value of slug thickness.

Citation Download Citation

Gwo-Jiun Sheu, Farn-Shiun Hwu, Shen-Hang Tu, Wen-Tung Chen, Jenq-Yang Chang, and Jyh-Chen Chen "The heat dissipation performance of LED applied a MHP", Proc. SPIE 5941, Fifth International Conference on Solid State Lighting, 594113 (14 September 2005); https://doi.org/10.1117/12.616355

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