Paper
3 December 2005 Design and fabrication of low-microwave loss coplannar waveguide and precise V groove on silicon substrate for optoelectronic packaging
Hua Yang, Hongliang Zhu, Hongyun Xie, Lingjuan Zhao, Fan Zhou, Wei Wang
Author Affiliations +
Proceedings Volume 6019, Passive Components and Fiber-based Devices II; 601938 (2005) https://doi.org/10.1117/12.635519
Event: Asia-Pacific Optical Communications, 2005, Shanghai, China
Abstract
Optoelectronic packaging has become a most important factor that influences the final performance and cost of the module. In this paper, low microwave loss coplanar waveguide(CPW) on high resistivity silicon(HRS) and precise V groove in silicon substrate were successfully fabricated. The microwave attenuation of the CPW made on HRS with the simple process is lower than 2 dB/cm in the frequency range of 0~26GHz, and V groove has the accuracy in micro level and smooth surface.These two techniques built a good foundation for high frequency packaging and passive coupling of the optoelectronic devices. Based on these two techniques, a simple high resistivity silicon substrate that integrated V groove and CPW for flip-chip packaging of lasers was completed. It set a good example for more complicate optoelectronic packaging.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hua Yang, Hongliang Zhu, Hongyun Xie, Lingjuan Zhao, Fan Zhou, and Wei Wang "Design and fabrication of low-microwave loss coplannar waveguide and precise V groove on silicon substrate for optoelectronic packaging", Proc. SPIE 6019, Passive Components and Fiber-based Devices II, 601938 (3 December 2005); https://doi.org/10.1117/12.635519
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KEYWORDS
Silicon

Microwave radiation

Waveguides

Optoelectronic packaging

Oxides

Packaging

Etching

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