Study on the packaging integrity testing for polymer micro-device

Xiao-Peng Wang; Tian-Ning Chen; Hua-Ling Chen; Yong-fu Huang; Qiang Wei

doi:10.1117/12.664140

21 March 2006 Study on the packaging integrity testing for polymer micro-device

Xiao-Peng Wang, Tian-Ning Chen, Hua-Ling Chen, Yong-fu Huang, Qiang Wei

Author Affiliations +

Proceedings Volume 6040, ICMIT 2005: Mechatronics, MEMS, and Smart Materials; 60400A (2006) https://doi.org/10.1117/12.664140
Event: ICMIT 2005: Merchatronics, MEMS, and Smart Materials, 2005, Chongqing, China

Abstract

To test the packaging integrity of high polymer micro-device fabricated by UV-LIGA technique, a new method of non-destructive testing was presented. This method is based on conductance analysis principle of electrochemistry. Dependence on the slight change of the current value in the solution, the packaging integrity of micro-device was measured and the stability of the packaging method was evaluated. The experiment apparatus for the conductance analysis method was built, and applied to test the packaging integrity of the micro-device. The experimental results show that the presented testing method is effective to measure the packaging integrity of the micro-device.

Citation Download Citation

Xiao-Peng Wang, Tian-Ning Chen, Hua-Ling Chen, Yong-fu Huang, and Qiang Wei "Study on the packaging integrity testing for polymer micro-device", Proc. SPIE 6040, ICMIT 2005: Mechatronics, MEMS, and Smart Materials, 60400A (21 March 2006); https://doi.org/10.1117/12.664140

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