Paper
18 May 2006 S-Ku band intelligent amplifier microsystem
Katherine J. Herrick, George Jerinic, Robert P. Molfino, Steven M. Lardizabal, Brandon Pillans
Author Affiliations +
Abstract
Progress-to-date of a S-Ku band intelligent amplifier microsystem is presented. Performance objectives are 0.5 Watt with 30%-55% power added efficiency across the band using a total of 10 RF MEMS. GaAs-to-GaAs and Borosilicate-to-GaAs low temperature (<250C) indium-gold wafer bonding is employed to provide hermeticity and integration of the pHEMT transistor with the RF MEMS. The compact mixed signal microsystem, 2 inches by 3 inches, utilizes an existing data processor with an intelligent control algorithm which optimizes the input and output circuit matching networks for optimal performance.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Katherine J. Herrick, George Jerinic, Robert P. Molfino, Steven M. Lardizabal, and Brandon Pillans "S-Ku band intelligent amplifier microsystem", Proc. SPIE 6232, Intelligent Integrated Microsystems, 62320W (18 May 2006); https://doi.org/10.1117/12.669718
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Amplifiers

Microsystems

Microelectromechanical systems

Semiconducting wafers

Gallium arsenide

Wafer bonding

Transistors

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