Patterning (4)
EUV Masks (I) (3)
EUV Masks (II) (4)
MDP and DFM (4)
OPC and RET (5)
Metrology (4)
Automatic pitch decomposition for improved process window when printing dense features at k1eff<0.20
Scatterometry based CD and profile metrology of chrome-less masks using optical digital profilometry