Paper
4 April 2007 Automatic setup of in-line critical dimension (CD) recipes during OPC qualification in a foundry environment
Yasri Yudhistira, Quek Shyue Fong, Chan Sun Sun, Koh Hui Peng, Rachel Ren, Sern Loong Ng, Amit Siany, Shimon Levi
Author Affiliations +
Abstract
In this paper, we study the feasibility of using a new system to set up offline critical dimension scanning electron microscope (CDSEM) recipes for both litho and etch processes monitoring in a foundry environment before first silicon. We will automatically create CDSEM measurement recipes based on CAD design data (2) and litho illumination information. The main advantages of having recipes setup done through this method as compared to performing recipe creation on the CDSEM tool itself are the reduction in CD-SEM tool usage and more importantly, the availability of the recipes before the first wafer is being processed in lithography resulting in a faster of cycle time for new devices. To facilitate our objective, a new feature was implemented in the design to provide a universal global alignment (GA) feature under both optical and SEM view. The global alignment serves two functions: to minimize device-to-device and layer-to-layer optical variation. It synchronizes design (CAD) and wafer coordinate systems. With this universal alignment feature available across all production layers of interest, we can fully automate recipe creation process from design to production.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yasri Yudhistira, Quek Shyue Fong, Chan Sun Sun, Koh Hui Peng, Rachel Ren, Sern Loong Ng, Amit Siany, and Shimon Levi "Automatic setup of in-line critical dimension (CD) recipes during OPC qualification in a foundry environment", Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 651809 (4 April 2007); https://doi.org/10.1117/12.712534
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KEYWORDS
Optical proximity correction

Computer aided design

Semiconducting wafers

Pattern recognition

Scanning electron microscopy

Optical alignment

Data modeling

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