Paper
18 June 2007 Dispersive white light interferometry for 3D inspection of thin film layers of flat panel displays
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Abstract
Emerging possibility of applying white-light interferometry to the area of thin-film metrology is addressed. Emphasis is given to explaining underlying spectrally-resolved interferometric principles of white-light interferometry for measuring the top surface profile as well as the thickness of thin-film layers, which enables one to reconstruct the complete 3-D tomographical view of the target surface coated with thin-film layers. Actual measurement results demonstrate that white-light interferometry in either scanning or dispersive scheme is found well suited for high speed 3-D inspection of dielectric thin-film layers deposited on semiconductor or glass substrates.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Young-Sik Ghim, Joonho You, and Seung-Woo Kim "Dispersive white light interferometry for 3D inspection of thin film layers of flat panel displays", Proc. SPIE 6616, Optical Measurement Systems for Industrial Inspection V, 66160T (18 June 2007); https://doi.org/10.1117/12.726040
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Cited by 1 scholarly publication and 2 patents.
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KEYWORDS
Thin films

Interferometry

Spectroscopy

Metrology

Inspection

Charge-coupled devices

3D metrology

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