Paper
12 November 2007 Technical issues of stainless steel foil substrates for OLED display applications
Yongtaek Hong, Seungjun Chung, Alex Kattamis, I-Chun Cheng, Sigurd Wagner
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Abstract
Key technical issues of flexible stainless steel foil substrates are addressed for OLED display backplane applications. Surface roughness and corresponding planarization layer technology development will be the major factors for the stainless steel foil substrates to be used for commercial applications. Promising candidates for the planarization layer materials are reviewed and some of the properties are addressed. In addition, if the substrate is sustained to a constant voltage for guaranteed circuit operation, capacitive coupling through the insulation and planarization dielectric layer, from the conductive substrate to the electrode and circuit elements on it, is also carefully analyzed for panel design and operation. Especially for large size high-resolution display applications, low k and thick planarization layer should be used.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yongtaek Hong, Seungjun Chung, Alex Kattamis, I-Chun Cheng, and Sigurd Wagner "Technical issues of stainless steel foil substrates for OLED display applications", Proc. SPIE 6655, Organic Light Emitting Materials and Devices XI, 66550N (12 November 2007); https://doi.org/10.1117/12.737213
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Cited by 3 scholarly publications.
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KEYWORDS
Organic light emitting diodes

Surface roughness

Capacitive coupling

Dielectrics

Glasses

Capacitance

Laser cutting

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