High density packing and interconnections for hybrid microelectronics: new trends in materials development

Małgorzata Jakubowska

doi:10.1117/12.784702

28 December 2007 High density packing and interconnections for hybrid microelectronics: new trends in materials development

Małgorzata Jakubowska

Author Affiliations +

Proceedings Volume 6937, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2007; 69371R (2007) https://doi.org/10.1117/12.784702
Event: Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2007, 2007, Wilga, Poland

Abstract

Electronic devices, components, circuits and microsystems continue to become smaller, lighter, faster and less expensive. The progress in hybrid microelectronics, especially in high density packaging and interconnections, is very much dependent on the achievements in developing new electronic materials. The paper presents the state of art of thick film materials as well as the new developments carried in Hybrid Mirocircuits and Microsystems Laboratory, which was established in 2006 by Warsaw University of Technology, Department of Electronics and Information Technology and Institute of Electronic Materials Technology.

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Małgorzata Jakubowska "High density packing and interconnections for hybrid microelectronics: new trends in materials development", Proc. SPIE 6937, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2007, 69371R (28 December 2007); https://doi.org/10.1117/12.784702

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