New packaging concepts for highly stable laser diode modules

Ekkehard Werner; Sabine Kretzschmar; Guido Bonati; Ramona Eberhardt

doi:10.1117/12.809978

24 February 2009 New packaging concepts for highly stable laser diode modules

Ekkehard Werner, Sabine Kretzschmar, Guido Bonati, Ramona Eberhardt

Proceedings Volume 7202, Laser-based Micro- and Nanopackaging and Assembly III; 720204 (2009) https://doi.org/10.1117/12.809978
Event: SPIE LASE: Lasers and Applications in Science and Engineering, 2009, San Jose, California, United States

Abstract

For mounting FAC lenses to diode lasers a new technology is introduced. Solder jet ball bumping is demonstrated to have the potential to replace conventional mounting technologies like adhesive bonding. The advantage of this method is a thermally and mechanically stable connection of micro optics and laser without drawbacks of outgasing and sensitivity to UV. The reached accuracy is within the range of one micrometer.

Citation Download Citation

Ekkehard Werner, Sabine Kretzschmar, Guido Bonati, and Ramona Eberhardt "New packaging concepts for highly stable laser diode modules", Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 720204 (24 February 2009); https://doi.org/10.1117/12.809978

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