High speed deformation measurement of electronic packages by the digital image correlation method

Jiangang Li; Fei Qin; Tong An; Ling Jin

doi:10.1117/12.839335

25 August 2009 High speed deformation measurement of electronic packages by the digital image correlation method

Jiangang Li, Fei Qin, Tong An, Ling Jin

Proceedings Volume 7375, ICEM 2008: International Conference on Experimental Mechanics 2008; 737558 (2009) https://doi.org/10.1117/12.839335
Event: International Conference on Experimental Mechanics 2008 and Seventh Asian Conference on Experimental Mechanics, 2008, Nanjing, China

Abstract

4-point dynamic bending tests of board level electronics packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data.

Citation Download Citation

Jiangang Li, Fei Qin, Tong An, and Ling Jin "High speed deformation measurement of electronic packages by the digital image correlation method", Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 737558 (25 August 2009); https://doi.org/10.1117/12.839335

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