Tool for bonded optical element thermal stability analysis

Gregory L. Klotz

doi:10.1117/12.892961

24 September 2011 Tool for bonded optical element thermal stability analysis

Gregory L. Klotz

Proceedings Volume 8125, Optomechanics 2011: Innovations and Solutions; 81250I (2011) https://doi.org/10.1117/12.892961
Event: SPIE Optical Engineering + Applications, 2011, San Diego, California, United States

Abstract

An analytical tool is presented which supports the opto-mechanical design of bonded optical elements. Given the mounting requirements from the optical engineer, the alignment stability and optical stresses in bonded optics can be optimized for the adhesive and housing material properties. While a perfectly athermalized mount is desirable, it is not realistic. The tool permits evaluation of element stability and stress over the expected thermal range at nominal, or worst case, achievable assembly and manufacturing tolerances. Selection of the most appropriate mount configuration and materials, which maintain the optical engineer's design, is then possible. The tool is based on a stress-strain analysis using Hooke's Law in the worst case plane through the optic centerline. The optimal bond line is determined for the selected adhesive, housing and given optic materials using the basic athermalization equation. Since a mounting solution is expected to be driven close to an athermalized design, the stress variations are considered linearly related to strain. A review of the equation set, the tool input and output capabilities and formats and an example will be discussed.

Citation Download Citation

Gregory L. Klotz "Tool for bonded optical element thermal stability analysis", Proc. SPIE 8125, Optomechanics 2011: Innovations and Solutions, 81250I (24 September 2011); https://doi.org/10.1117/12.892961

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