Wafer-level micro-optics: trends in manufacturing, testing, and packaging

Reinhard Voelkel; Kenneth J. Weible; Martin Eisner

doi:10.1117/12.897114

30 September 2011 Wafer-level micro-optics: trends in manufacturing, testing, and packaging

Reinhard Voelkel, Kenneth J. Weible, Martin Eisner

Proceedings Volume 8169, Optical Fabrication, Testing, and Metrology IV; 81690C (2011) https://doi.org/10.1117/12.897114
Event: SPIE Optical Systems Design, 2011, Marseille, France

Abstract

Micro-optics is an indispensable key enabling technology (KET) for many applications today. The important role of micro-optical components is based on three different motivations: miniaturization, high functionality and packaging aspects. It is obvious that miniaturized systems require micro-optics for light focusing, light shaping and imaging. More important for industrial applications is the high functionality of micro-optics that allows combining these different functions in one element. In DUV Lithography Steppers and Scanners an extremely precise beam shaping of the Excimer laser profile is required. High-precision diffractive optical elements are well suited for this task. For Wafer-Level Cameras (WLC) and fiber optical systems the packaging aspects are more important. Wafer-Level Micro-Optics technology allows manufacturing and packaging some thousands of sub-components in parallel. We report on the state of the art in wafer-based manufacturing, testing and packaging.

Citation Download Citation

Reinhard Voelkel, Kenneth J. Weible, and Martin Eisner "Wafer-level micro-optics: trends in manufacturing, testing, and packaging", Proc. SPIE 8169, Optical Fabrication, Testing, and Metrology IV, 81690C (30 September 2011); https://doi.org/10.1117/12.897114

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