Active or passive fiber-chip-alignment: approaches to efficient solutions

Gunnar Böttger; Henning Schröder; Rafael Jordan

doi:10.1117/12.2014176

27 February 2013 Active or passive fiber-chip-alignment: approaches to efficient solutions

Gunnar Böttger, Henning Schröder, Rafael Jordan

Proceedings Volume 8630, Optoelectronic Interconnects XIII; 863006 (2013) https://doi.org/10.1117/12.2014176
Event: SPIE OPTO, 2013, San Francisco, California, United States

Abstract

High precision approaches for active and passive alignment and assembly on optoelectronic micro benches have been realized at Fraunhofer IZM for various material systems and different scales. The alignment and reliable mounting of optical subcomponents such as semiconductor laser and photo diodes, micro lenses and micro prisms require far higher mounting and alignment accuracies than for micro-electronic parts. When connecting from silicon photonics chip level to single mode optical fibers, even higher precisions are called for (typically < 100 nm). Alignment and assembly commonly are performed on specialized lab equipment which needs manual operation, consuming a lot of time, with less possibilities for automation. To introduce a higher degree of automatized production, like it has become standard in large volume electronics, one can choose either active or passive alignment processes - or possibly a combination of both. In this article we will present examples of micro-optic benches and optical interconnections that include alignment structures for passive alignment - where the accuracy lies in the components to be assembled, and mounting takes place on a less accurate machine (“fit into place”). But there is also a lot of progress on optical "pick, measure and place" machines that realize a flexible and fully automated active alignment using vision systems and activated components of less cost, with machine and process robustness for usability in industrial environments. As connecting elements, passive optical components like optical fibers are commonly used. These fragile and flexible elements pose additional challenges in secure picking, placing and fixing, at long lengths vs. small diameters. A very recent and specific approach to use more robust plastic optical fibers (POF) for very short and cost effective optical interconnects by means of wire bonding machines will be presented.

Citation Download Citation

Gunnar Böttger, Henning Schröder, and Rafael Jordan "Active or passive fiber-chip-alignment: approaches to efficient solutions", Proc. SPIE 8630, Optoelectronic Interconnects XIII, 863006 (27 February 2013); https://doi.org/10.1117/12.2014176

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available