High performance 7.4-micron interline transfer CCD platform for applied imaging markets

Douglas A. Carpenter; James A. DiBella; Robert Kaser; Brent Kecskemety; Stephen L. Kosman; John P. McCarten; Christopher Parks

doi:10.1117/12.982017

19 February 2013 High performance 7.4-micron interline transfer CCD platform for applied imaging markets

Douglas A. Carpenter, James A. DiBella, Robert Kaser, Brent Kecskemety, Stephen L. Kosman, John P. McCarten, Christopher Parks

Author Affiliations +

Proceedings Volume 8659, Sensors, Cameras, and Systems for Industrial and Scientific Applications XIV; 865908 (2013) https://doi.org/10.1117/12.982017
Event: IS&T/SPIE Electronic Imaging, 2013, Burlingame, California, United States

Abstract

Technology developed for a 5.5 μm pixel interline transfer CCD family has been incorporated into a new family of highperformance 7.4 μm pixel CCDs, providing significant improvements in several key performance parameters compared to both the 5.5 μm family as well as the previous generation of 7.4 μm pixel products. Smear in the new platform has been reduced to -115 dB, and frame rate has been doubled relative to the previous generation of 7.4 μm pixel products. Dynamic range in normal operation has been improved to 70 dB, and the platform supports a new extended dynamic range mode which provides 82 dB when binning 2 × 2. The new family leverages the package and pin-out configurations used in the 5.5 μm pixel family, allowing easy integration into existing camera designs.

Citation Download Citation

Douglas A. Carpenter, James A. DiBella, Robert Kaser, Brent Kecskemety, Stephen L. Kosman, John P. McCarten, and Christopher Parks "High performance 7.4-micron interline transfer CCD platform for applied imaging markets", Proc. SPIE 8659, Sensors, Cameras, and Systems for Industrial and Scientific Applications XIV, 865908 (19 February 2013); https://doi.org/10.1117/12.982017

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