Nondestructive optical characterization of MEMS

Ryszard J.  Pryputniewicz

doi:10.1117/12.2036620

10 October 2013 Nondestructive optical characterization of MEMS

Ryszard J. Pryputniewicz

Proceedings Volume 8916, Sixth International Symposium on Precision Mechanical Measurements; 891602 (2013) https://doi.org/10.1117/12.2036620
Event: Sixth International Symposium on Precision Mechanical Measurements, 2013, Guiyang, China

Abstract

Advances in emerging technology of microelectromechanical systems (MEMS) are one of the most challenging tasks in today's experimental mechanics. More specifically, development of these miniature devices requires sophisticated design, analysis, fabrication, testing, and characterization tools that have multiphysics and multiscale capabilities, especially as MEMS are being developed for use at harsh conditions. In harsh-environment and high-performance guidance applications inertial sensors must be sensitive to low rates of rotation yet survive the high blast loads associated with the initial launch. In this multi-year study a set of tuning fork gyroscopes (TFGs) were subjected to a series of increasing g-loads (culminating at approximately 60,000 g’s) with measurements of shape made after each test. High-g-testing was conducted within the large test chamber using a custom fabricated mini powder gun. A custom set of test sample packages were hermetically sealed with glass lids to allow optical inspection of components while preserving the operating (vacuum) environment. Optical and interferometric measurements have been made prior to and after each shock g-loading. The shape of the TFG test articles was measured using optoelectronic laser interferometric microscope (OELIM) methodology. Line traces were extracted from pertinent structures to clearly examine changes in the TFG. Failure of the die was observed in the form of fractures below the chip surface as well as fractures in the glass lid sealing the package.

Citation Download Citation

Ryszard J. Pryputniewicz "Nondestructive optical characterization of MEMS", Proc. SPIE 8916, Sixth International Symposium on Precision Mechanical Measurements, 891602 (10 October 2013); https://doi.org/10.1117/12.2036620

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