Paper
27 March 2014 Improved adhesion of novolac and epoxy based resists by cationic organic materials on critical substrates for high volume patterning applications
Anja Voigt, Gisela Ahrens, Marina Heinrich, Andrew Thompson, Gabi Gruetzner
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Abstract
Microlithography uses a variety of resists and polymer materials to create patterns and lithographic structures on several types of substrates. Excellent adhesion of the resists and polymers to the substrate is a prerequisite for successful patterning and pattern transfer. This paper presents the results of an investigation of the effects of an adhesion promoter, SurPass, on the lithographic process when used in combination with a variety of resists, and substrate materials. SurPass is a waterborne, non-hazardous, cationic organic surface active agent that promotes adhesion by modifying the substrate surface energy without deposition, chemical change or impact on electrical properties of the substrate material. The effectiveness of SurPass in combination with several novolac and epoxy resists on various substrate materials will be presented.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Anja Voigt, Gisela Ahrens, Marina Heinrich, Andrew Thompson, and Gabi Gruetzner "Improved adhesion of novolac and epoxy based resists by cationic organic materials on critical substrates for high volume patterning applications", Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90511K (27 March 2014); https://doi.org/10.1117/12.2046258
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Cited by 1 scholarly publication and 1 patent.
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KEYWORDS
Silicon

Epoxies

Optical lithography

Photoresist processing

Electroplating

Nickel

Head-mounted displays

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