Paper
18 March 2015 Double-sided diffractive photo-mask for sub-500nm resolution proximity i-line mask-aligner lithography
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Abstract
Diffractive mask-aligner lithography is capable to print structures that have a sub-500-nanometer resolution by using non-contact mode. This requires the use of specially designed phase-masks and dedicated illumination conditions in the Mask-Aligner to obtain the optimal exposure conditions, a spectral filter and a polarizer needs to be placed in the beam path. We introduce here mask designs that includes a polarizer on the top side of a photo-mask and a diffractive element on the bottom one. This enables printing of high resolution structures of arbitrary orientation by using a classical mask-aligner in proximity exposure mode.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yannick Bourgin, Thomas Siefke, Thomas Käsebier, Ernst-Bernhard Kley, and Uwe D. Zeitner "Double-sided diffractive photo-mask for sub-500nm resolution proximity i-line mask-aligner lithography", Proc. SPIE 9426, Optical Microlithography XXVIII, 94260E (18 March 2015); https://doi.org/10.1117/12.2085777
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Cited by 1 scholarly publication.
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KEYWORDS
Photomasks

Polarizers

Lithography

Etching

Chromium

Lithographic illumination

Photomicroscopy

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